Numerical implementation and validation of a viscoelastic-plastic material model for predicting curing induced residual stresses in adhesive bonded joints
Akshat Agha, Fadi Abu-Farha
Topics & Concepts
AdhesiveMaterials scienceViscoelasticityComposite materialCuring (chemistry)Residual stressResidualLayer (electronics)Computer scienceAlgorithmEpoxy Resin Curing ProcessesMechanical Behavior of CompositesInjection Molding Process and Properties