Novel, flexible, and transparent thin film polyimide aerogels with enhanced thermal insulation and high service temperature
Omid Aghababaei Tafreshi, Shahriar Ghaffari-Mosanenzadeh, Solmaz Karamikamkar, Zia Saadatnia, Sophie Kiddell, Chul B. Park, Hani E. Naguib
Abstract
Due to their high service temperature, excellent thermal insulation, and nanoporous morphology, polyimide (PI) aerogels have the potential capability to be used in the next generation of microelectronic devices and flexible electronics.
Topics & Concepts
PolyimideMaterials scienceMicroelectronicsNanoporousThermal insulationFlexible electronicsComposite materialAerogelThermalElectronicsThermal management of electronic devices and systemsOptoelectronicsLayer (electronics)NanotechnologyElectrical engineeringMechanical engineeringPhysicsEngineeringMeteorologyAerogels and thermal insulationSynthesis and properties of polymersSilicone and Siloxane Chemistry