All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints
Michael Njuki, Abdullah Faisal Pasha, Ronit Das, Peter Børgesen, Nikolay Dimitrov
Topics & Concepts
SolderingEutectic systemMaterials scienceElectroplatingMetallurgyPlating (geology)BismuthInterconnectionAlloyTinReliability (semiconductor)Composite materialComputer scienceLayer (electronics)Computer networkPower (physics)PhysicsGeophysicsQuantum mechanicsGeologyElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesElectrodeposition and Electroless Coatings