TXV Technology: The cornerstone of 3D system-in-packaging
Heran Zhao, Mingxiang Chen, Peng Yang, Qing Wang, Min Kang, Lihua Cao
Topics & Concepts
MiniaturizationCornerstoneSystem in packageCeramicInterconnectionMaterials scienceFabricationSubstrate (aquarium)Enhanced Data Rates for GSM EvolutionElectronic packagingThrough-silicon viaSiliconWire bondingProcess (computing)NanotechnologyMechanical engineeringComputer scienceEngineeringElectrical engineeringOptoelectronicsTelecommunicationsChipComposite materialGeologyPathologyMedicineVisual artsOceanographyAlternative medicineArtOperating system3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectrical and Thermal Properties of Materials