Litcius/Paper detail

Effect of Cr and Sn additions on microstructure, mechanical-electrical properties and softening resistance of Cu–Cr–Sn alloy

Jiazhi Li, Hua Ding, Baomian Li, Weilin Gao, Jie Bai, Gang Sha

2020Materials Science and Engineering A124 citationsDOI

Topics & Concepts

Materials scienceAlloyMicrostructureElectron backscatter diffractionPrecipitationUltimate tensile strengthMetallurgyAtom probeTransmission electron microscopyElectrical resistivity and conductivityRecrystallization (geology)Indentation hardnessSofteningElectrical resistance and conductanceComposite materialNanotechnologyBiologyPhysicsEngineeringPaleontologyElectrical engineeringMeteorologyMicrostructure and mechanical propertiesAluminum Alloy Microstructure PropertiesAdvanced materials and composites