Recent advances in polymer-based electronic packaging materials
Yan‐Jun Wan, Gang Li, Yimin Yao, Xiaoliang Zeng, Pengli Zhu, Rong Sun
Topics & Concepts
Materials scienceElectronic packagingFlip chipPolymerFiller (materials)Electronic materialsElectronicsThermal greaseNanotechnologyComposite materialThermal conductivityElectrical engineeringEngineeringLayer (electronics)AdhesiveElectromagnetic wave absorption materialsDielectric materials and actuatorsPolymer Nanocomposites and Properties