Heat spreading performance of SiC-based power module with bonded vapour chamber for electric powertrain integration
Bo Li, Yiyi Chen, Xuehui Wang, Yong Li, Yuying Yan
Topics & Concepts
Materials scienceCoolantSilicon carbideJunction temperatureOptoelectronicsPower moduleElectric vehicleThermal resistanceHeat sinkPower semiconductor deviceElectrical engineeringMechanical engineeringPower (physics)Nuclear engineeringVoltageComposite materialHeat transferEngineeringMechanicsQuantum mechanicsPhysicsSilicon Carbide Semiconductor TechnologiesHeat Transfer and OptimizationElectromagnetic Compatibility and Noise Suppression