Study on material removal mechanism and surface formation characteristics of reaction-bonded silicon carbide by electrical discharge grinding technology
Shibo Deng, Longzhou Dai, Mingtao Wu
Topics & Concepts
GrindingMaterials scienceSilicon carbideElectrical discharge machiningCeramicMachiningSurface roughnessImpact craterComposite materialThermal conductionRADIUSElectric dischargeMetallurgyElectrodeAstronomyChemistryComputer securityComputer sciencePhysicsPhysical chemistryAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesAdvanced machining processes and optimization