Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life
Deng Yun Chen, Michael Osterman, Abhijit Dasgupta
Topics & Concepts
SolderingMicroelectronicsMaterials scienceTinReliability (semiconductor)InterconnectionCopperStrain energy density functionMetallurgyStrain energyTemperature cyclingJoint (building)Forensic engineeringStructural engineeringComputer scienceEngineeringFinite element methodNanotechnologyThermodynamicsComputer networkThermalPower (physics)PhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties