The influence of solder oxidation on low-temperature solid-state bonding based on Ni micro-nano cones
Yan Peng, Liping Tang, Yaqian Sun, Anmin Hu, Ming Li
Topics & Concepts
SolderingMaterials scienceOxideInterconnectionMetallurgyNano-Composite materialComputer networkComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrical Contact Performance and Analysis