Experimental analysis of a heat sink for electronic chipset cooling using a nano improved PCM (NIPCM)
P. Manoj Kumar, Rajasekaran Saminathan, A. Sumayli, Manoj Mittal, A.S. Abishek, A. S. Atharsh Kumaar, Tadimarri Dinesh Kumar Reddy, Moti Lal Rinawa
Topics & Concepts
Heat sinkChipsetPhase-change materialMaterials scienceComputer coolingThermal resistanceThermalThermal management of electronic devices and systemsFinThermodynamicsNuclear engineeringComposite materialMechanical engineeringElectrical engineeringEngineeringPhysicsChipPhase Change Materials ResearchAdsorption and Cooling SystemsHeat Transfer and Optimization