Thermal and mechanical reliability of thermal through-silicon vias in three-dimensional integrated circuits
Chenlei Qu, Ruoyu Dai, J. Q. Zheng, Yusheng Hu, Jinhao Zhang
Topics & Concepts
Materials scienceThermalReliability (semiconductor)Heat transferThermal conductionFinite element methodIntegrated circuitThermal bridgeMechanical engineeringThree-dimensional integrated circuitStress (linguistics)Through-silicon viaElectronic engineeringComposite materialSiliconStructural engineeringEngineeringMechanicsOptoelectronicsThermal insulationLayer (electronics)ThermodynamicsLinguisticsPower (physics)PhysicsPhilosophy3D IC and TSV technologiesSemiconductor materials and devicesThin-Film Transistor Technologies