Litcius/Paper detail

Transient thermal analysis of close pressure thermoforming process

Jeet Patil, Vilas M. Nandedkar, Sushil Mishra, Sandip K. Saha

2021Journal of Manufacturing Processes14 citationsDOI

Topics & Concepts

ThermoformingMaterials scienceThermalComposite materialHeat transferTransient (computer programming)Forming processesProcess (computing)Temperature measurementMechanical engineeringMechanicsThermodynamicsComputer scienceEngineeringPhysicsOperating systemTextile materials and evaluationsAdhesion, Friction, and Surface InteractionsMaterial Properties and Processing