Design guideline on board-level thermomechanical reliability of 2.5D package
Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, Seungbae Park, Hohyung Lee, Laurene Yip, Gamal Refai-Ahmed
Topics & Concepts
Temperature cyclingFinite element methodReliability (semiconductor)Junction temperatureSolderingMiniaturizationMechanical engineeringElectronic packagingEngineeringClampingPower cyclingStructural engineeringMaterials scienceElectronic engineeringThermalPower (physics)Electrical engineeringComposite materialPhysicsMeteorologyQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis