Wear measurement of ultrathin grinding wheel using fiber optical sensor for high-precision wafer dicing
Fengjun Chen, Jianhang Huang, Jialiang Xu, Huidong Wang, Hu Tian
Topics & Concepts
Wafer dicingMaterials scienceWaferSIGNAL (programming language)Grinding wheelGrindingOptical fiberSurface grindingAcousticsEngineeringComputer scienceComposite materialOptoelectronicsTelecommunicationsPhysicsProgramming languageAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Measurement and Metrology Techniques