Effect of gradient polishing depth on material removal mechanism of silicon wafer polishing by silicon dioxide abrasive based on molecular dynamics
Jianbo Le, Juan Liu, Miao Mei, Long‐Qing Chen, Hong Jiang, Dongling Yu
Topics & Concepts
PolishingMaterials scienceWaferAbrasiveChemical-mechanical planarizationSilicon dioxideSiliconMechanism (biology)Composite materialMetallurgyOptoelectronicsEpistemologyPhilosophyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques