Copper bonding silicon nitride substrate using atmosphere plasma spray
Guanghua Liu, Dan Wang, Yan Xing, Xiqiang Zhong, Wei Pan
Topics & Concepts
Materials scienceSilicon nitrideUltimate tensile strengthSubstrate (aquarium)Composite materialCeramicSiliconElectrical resistivity and conductivityNitrideThermal conductivityFracture toughnessMetallurgyLayer (electronics)OceanographyElectrical engineeringEngineeringGeologyAdvanced ceramic materials synthesisMetal and Thin Film MechanicsMXene and MAX Phase Materials