Comparative investigation of dynamic damping and fracture in viscoelastic dampers with two different interfacial bonding types: molecular dynamics simulations and device tests
Yeshou Xu, Min Mao, Xing‐Huai Huang, Ying‐Qing Guo, Yang Yang, Yao‐Rong Dong, Syed Ahmad Ali Shah, Xinyu Gao, Muhammad Usman, Seong‐Hoon Jeong
Topics & Concepts
Materials scienceViscoelasticityComposite materialDamperDissipationDynamic mechanical analysisDynamic modulusEpoxyFracture (geology)Fracture mechanicsDeformation (meteorology)Molecular dynamicsStandard linear solid modelShear modulusModulusCrackingStrain energyShear (geology)Structural engineeringStress (linguistics)Shear stressStrain energy release rateCohesive zone modelUltimate tensile strengthElastic energyCreepEnergy storageStrain rateFracture toughnessDynamic loadingVibration Control and Rheological FluidsElasticity and Material ModelingSeismic Performance and Analysis