Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics
Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu, Zhiwen Chen, Shangyu Huang, Changqing Liu, Xueqiang Cao
Topics & Concepts
Materials scienceSolderingSinteringCompactionComposite materialFabricationCorrosionDie (integrated circuit)MetallurgyNanotechnologyMedicineAlternative medicinePathologyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced materials and composites