Modification copper surface by micron thickness film via thiol-based click reaction
Juan Qiu, Xiang Gao, Kanglu Feng, Houyi Ma
Topics & Concepts
SilaneEpoxyCopperAdsorptionThiolMaterials scienceClick chemistryPolymer chemistryDithiolCatalysisChemical engineeringSurface modificationChemistryComposite materialOrganic chemistryMetallurgyEngineeringMolecular Junctions and NanostructuresCopper Interconnects and ReliabilityNanofabrication and Lithography Techniques