Molecular simulation on the rheological properties of phenolic resins during crosslinking
Yu Qiao, Bing Sun, Hongtao Wang, Lei Dong, Jianyu Wu, Yanping Wang, Yanping Wang
Topics & Concepts
RheologyThermosetting polymerCuring (chemistry)Gel pointMaterials scienceViscosityMolecular dynamicsFormaldehydePhenolChemical engineeringComposite materialPolymer chemistryThermodynamicsChemistryOrganic chemistryComputational chemistryEngineeringPhysicsEpoxy Resin Curing ProcessesLignin and Wood ChemistryPolymer composites and self-healing