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Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints

Ehsan H. Sabbar, Hazim A. Al-Zubaidi, Amer K. Aljumaili, Mustafa Hamid Al-Jumaili, Ahmed Al-Jumaili, Hussein Alsheakh

2023Microelectronics Reliability33 citationsDOI

Topics & Concepts

IntermetallicSolderingMicrostructureEutectic systemMaterials scienceScanning electron microscopeMetallurgyJoint (building)Composite materialAlloyEngineeringArchitectural engineeringElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies
Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints | Litcius