Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing
Qiufa Luo, Jing Lu, Zige Tian, Feng Jiang
Topics & Concepts
WaferPolishingMaterials scienceAbrasiveBrittlenessNanometreNanoscopic scaleChemical-mechanical planarizationDiamondComposite materialScratchNanotechnologyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics