Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints
Suchart Chantaramanee, Phairote Sungkhaphaitoon
Topics & Concepts
SolderingMicrostructureMaterials scienceThermalMetallurgyComposite materialThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies