High strength, stable and self-healing copolyimide for defects induced by mechanical and electrical damages
Baoquan Wan, Xiaodi Dong, Xing Yang, Ming‐Sheng Zheng, George Chen, Jun‐Wei Zha
Abstract
A copolyimide (CPI) was prepared by a simple copolymerization process. The film possesses good self-healing ability based on disulfide bond exchange after mechanical/electrical damage and maintains high thermal stability and insulation property.
Topics & Concepts
Materials scienceSelf-healingSelf-healing materialCopolymerComposite materialDisulfide bondThermal stabilityMechanical strengthDamagesPolymerChemical engineeringLawMedicineChemistryBiochemistryPathologyEngineeringAlternative medicinePolitical sciencePolymer composites and self-healingSynthesis and properties of polymersSilicone and Siloxane Chemistry