Integrated embedded cooling method for thermal management in multilayer ceramic circuit substrate microsystems for multi-chip components
Wei He, Yang Zhao, Dinghua Hu, Jiaqi Li, Qiang Li
Topics & Concepts
MicrosystemMaterials scienceThermal management of electronic devices and systemsSubstrate (aquarium)ChipCeramicIntegrated circuitThermalOptoelectronicsActive coolingWater coolingMechanical engineeringComputer scienceNanotechnologyComposite materialThermodynamicsPhysicsTelecommunicationsOceanographyEngineeringGeologyHeat Transfer and Optimization3D IC and TSV technologiesElectronic Packaging and Soldering Technologies