An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing
Gengzhuo Li, Chen Xiao, Shibo Zhang, Ruoyu Sun, Yongbo Wu
Topics & Concepts
AbrasiveMaterials scienceWaferDiamondGrindingPolishingChemical-mechanical planarizationSiliconSurface roughnessComposite materialSurface finishMetallurgyOptoelectronicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchNanowire Synthesis and Applications