Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses
Dongjin Kim, Sangmin Lee, Chuantong Chen, Seung‐Joon Lee, Shijo Nagao, Katsuaki Suganuma
Topics & Concepts
Materials scienceMicrostructureComposite materialThermal shockElectron backscatter diffractionJoint (building)Void (composites)Structural engineeringEngineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis