Theoretical model of warping deformation during self-rotating grinding of YAG wafers
Chen Li, Yuxiu Hu, Shuqiang Huang, Binbin Meng, Yinchuan Piao, Feihu Zhang
Topics & Concepts
Image warpingGrindingMaterials scienceWaferDeformation (meteorology)AbrasiveMachiningStress (linguistics)Composite materialMechanical engineeringMetallurgyComputer scienceOptoelectronicsEngineeringArtificial intelligencePhilosophyLinguisticsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques