Ultrasonic monitoring of adhesive curing process between adherends
Tadaharu Adachi, Yosuke Ishii, Kazuma Hirota, Daiki TANABE
Topics & Concepts
Materials scienceAdhesiveComposite materialStiffnessUltrasonic sensorCuring (chemistry)EpoxyAcoustic impedanceReflection coefficientTransmission coefficientLayer (electronics)AcousticsOpticsTransmission (telecommunications)Electrical engineeringEngineeringPhysicsUltrasonics and Acoustic Wave PropagationAcoustic Wave Resonator TechnologiesEpoxy Resin Curing Processes