Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property
Di Liu, Tianyue Bai, Yuanyuan Qiao, Haoran Ma, Dong Wei, Ning Zhao
Topics & Concepts
Materials scienceBall grid arrayMicrostructureSolderingBall (mathematics)Composite materialLaserMetallurgyOpticsMathematicsMathematical analysisPhysics3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies