Improvement of the bonding strength of A2/Cu interface by Co, Ni, P and B addition in planar flow casting process based on first-principle calculations
Rui Guo, Siqian Bao, Yifei Feng, Deming Xu, Yuanyao Cheng
Topics & Concepts
Materials scienceDopantCovalent bondStackingDopingChemical bondCastingPhase (matter)NanotechnologyThermodynamicsComposite materialOrganic chemistryOptoelectronicsChemistryPhysicsAdvanced materials and compositesMetal and Thin Film MechanicsAluminum Alloys Composites Properties