Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry
Jianghao Liu, Xinhuan Niu, Yingqian Jia, Ni Zhan, Yida Zou, Yunhui Shi, Jianwei Zhou
Topics & Concepts
Chemical-mechanical planarizationPolishingSlurryCopperMaterials scienceIntegrated circuitTribologyMetallurgyPrinted circuit boardComposite materialOptoelectronicsElectrical engineeringEngineeringAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices