Effects of grinding speeds on the subsurface damage of single crystal silicon based on molecular dynamics simulations
Penghui Li, Xiaoguang Guo, Song Yuan, Ming Li, Renke Kang, Dongming Guo
Topics & Concepts
GrindingMaterials scienceSiliconDiamondMolecular dynamicsDiamond toolMachiningCrystal (programming language)Ultimate tensile strengthComposite materialGroove (engineering)Diamond turningMetallurgyChemistryComputer scienceProgramming languageComputational chemistryAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis