Thermal mismatch stress and substructure evolution of SiCp/Al-Si-Mg composites with different interface bonding during thermal cycles
Qi Yan, Lina Jia, Chengtong Ye, Zuheng Jin, Rui Liu, Wenbo Wang, Hu Zhang
Topics & Concepts
Materials scienceSubstructureComposite materialThermalStress (linguistics)Interface (matter)Structural engineeringMeteorologyLinguisticsCapillary numberPhilosophyEngineeringCapillary actionPhysicsAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisIntermetallics and Advanced Alloy Properties