Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
Emna Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont
Topics & Concepts
Ball grid arrayMaterials scienceSolderingMicrostructureTinJoint (building)Stress (linguistics)Composite materialAnisotropyMetallurgyStructural engineeringEngineeringQuantum mechanicsPhilosophyPhysicsLinguisticsElectronic Packaging and Soldering TechnologiesMetallurgy and Material FormingMetal Forming Simulation Techniques