Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability
Zhengwei Fan, Xun Chen, Yu Jiang, Xingge Li, Shufeng Zhang, Yashun Wang
Topics & Concepts
Reliability (semiconductor)Materials scienceStructural engineeringFracture mechanicsThrough-silicon viaMicrostructureService lifeProcess (computing)Coupling (piping)ThermalMechanical engineeringComputer scienceComposite materialEngineeringSiliconMetallurgyMeteorologyOperating systemPhysicsPower (physics)Quantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies