Electrostatic assembly of charge-modulated MXene and graphene oxide into conductive porous nanohybrids via rapid annealing for EMI shielding
Seung Hee Woo, Juyun Lee, Jeong Pil Kim, Junpyo Hong, Jeong Min Jang, Tae Yun Ko, Yun Chan Kang, Dae Woo Kim, Seon Joon Kim
Abstract
• Charge-modulated GO and MXene nanosheets were electrostatically assembled into hybrid structures. • A rapid annealing technique was used to transform hybrids into electrically conductive, porous MXene-rGO hybrid films. • Porous MXene-rGO films demonstrated good EMI shielding properties at the X-band and Ka-band. • The enhancement in EMI shielding upon rapid annealing was dominantly due to the increment in SE A . With the proliferation of devices for 5 G communication and the advent of future mobility, the management of electromagnetic interference (EMI) has become crucial. While traditional metal-based films exhibit high EMI shielding effectiveness (SE), the demand for lightweight materials and structures for high energy efficiency is desired in future applications. This study presents an approach for fabricating electrically conductive and porous MXene-reduced graphene oxide (rGO) hybrids with improved EMI shielding performance through electrostatic assembly and rapid annealing techniques. Here, the GO surface was converted to a positive charge using poly(diallyldimethylammonium chloride) (PDDA) to induce electrostatic assembly with negatively charged MXene nanosheets. To induce extensive porous structures and simultaneously reduce graphene oxide to provide electrical conductivity, MXene-GO hybrid films were rapidly annealed at 600 °C. The resulting porous hybrid films exhibited significantly improved EMI shielding effectiveness in the X-band and Ka-band, with SE T values increasing by up to 20 dB. It was also revealed that this increment was dominantly contributed by the increase in SE A rather than SE R . Furthermore, the hybrids demonstrated enhanced heat dissipation compared to pristine MXene EMI shielding films. We believe that our work proposes a facile fabrication method in developing advanced materials for EMI shielding applications in 5 G communication systems.