Electromigration in solder joints: A cross-sectioned model system for real-time observation
Mostafa M. Abdel‐Aziz, Di Xu, Guotao Wang, M. Mayer
Topics & Concepts
ElectromigrationCurrent crowdingSolderingVoid (composites)MiniaturizationJoule heatingMaterials scienceCurrent densityComposite materialJoint (building)Current (fluid)Forensic engineeringElectrical engineeringStructural engineeringNanotechnologyEngineeringPhysicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure AnalysisCopper Interconnects and Reliability