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Reduction of interfacial thermal transport of bilayer in-plane graphene/hexagonal boron nitride heterostructures via interlayer sp3 bonds, defects and stacking angle

Lei Fan, Wenjuan Yao

2021Diamond and Related Materials21 citationsDOI

Topics & Concepts

HeterojunctionStackingvan der Waals forceMaterials scienceBilayerGrapheneCovalent bondNanotechnologyCondensed matter physicsChemical physicsChemistryOptoelectronicsMoleculeMembraneOrganic chemistryPhysicsBiochemistryGraphene research and applicationsThermal properties of materials2D Materials and Applications
Reduction of interfacial thermal transport of bilayer in-plane graphene/hexagonal boron nitride heterostructures via interlayer sp3 bonds, defects and stacking angle | Litcius