Litcius/Paper detail

Effect of Bi content and aging on solder joint shear properties considering strain rate

Mohamed El Amine Belhadi, Sa’d Hamasha, Ali Alahmer

2023Microelectronics Reliability25 citationsDOI

Topics & Concepts

Materials scienceBrittlenessSolderingShear (geology)Composite materialDirect shear testStrain rateShear stressShear strength (soil)MetallurgySoil scienceEnvironmental scienceSoil waterElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties
Effect of Bi content and aging on solder joint shear properties considering strain rate | Litcius