Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
Topics & Concepts
Fan-outFan-inFlip chipChipMechanical fanEngineeringComputer scienceMaterials scienceMechanical engineeringElectrical engineeringNanotechnologyLayer (electronics)Adhesive3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesVLSI and Analog Circuit Testing