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Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

Feng Li, Vadimas Verdingovas, Kai Dirscherl, Gábor Harsányi, Bálint Medgyes, Rajan Ambat

2020Journal of Materials Science Materials in Electronics29 citationsDOI

Topics & Concepts

Materials scienceMicrostructureAlloyScanning electron microscopeMetallurgySolderingGalvanic corrosionCorrosionPassivationEnergy-dispersive X-ray spectroscopyGalvanic cellComposite materialLayer (electronics)Electronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy Properties
Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys | Litcius