Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips
Yaojun Chen, Bo Jing, Jianfeng Li, Xiaoxuan Jiao, Jiaxing Hu, Yun Wang
Abstract
In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, the random vibration test was conducted. Second, a lognormal distribution model of solder joints by means of the life data was established and analyzed based on the fracture mechanics theory. Finally, the finite-element simulation model of BGA packaged electronic chip was established and discussed. Failure characteristics of solder joints at different positions in electronic chips were compared and the failure mode of the solder joint was discussed using the simulation result and the observation result with scanning electron microscope (SEM). The results show that the life of each single solder joint in BGA packaged electronic chips follows a logarithmic normal distribution under the random vibration. Solder balls located at the four outermost corners of the chip are subjected to the greatest stress, which are the weakest parts in electronic chips. Cracks in solder joints are generated near the package side and emerged from the edge of the intermetallic compound (IMC) layer with the largest curvature.