Lignin‐Based Encapsulation of Liquid Metal Particles for Flexible and High‐Efficiently Recyclable Electronics (Adv. Funct. Mater. 7/2024)
Yong Zheng, Hai Liu, Yan Li, Haiyue Yang, Lin Dai, Chuanling Si
Abstract
Green Encapsulation In article number 2310653, Lin Dai, Chuanling Si, and co-workers present a green and facile lignin-based encapsulation method for room-temperature liquid metals with controllable sizes, good stability, dispersibility, adhesion, and extremely high recovery efficiency, that pioneer a promising application of lignin in high-precision fields and promote transformation and upgrading of traditional lignin valorization.
Topics & Concepts
Materials scienceEncapsulation (networking)ElectronicsNanotechnologyLigninMetalLiquid metalComposite materialMetallurgyOrganic chemistryElectrical engineeringComputer scienceChemistryEngineeringComputer networkLignin and Wood Chemistry