Degradation of plated silicon solar module due to copper diffusion: The role of capping layer formation and contact adhesion
Benjamin Phua, Xiaowei Shen, Pei‐Chieh Hsiao, Charlie Kong, Alex Stokes, Alison Lennon
Topics & Concepts
Materials scienceCopperDurabilityAdhesionDiffusion barrierComposite materialPlating (geology)Immersion (mathematics)Copper platingBusbarMetallurgyElectroplatingLayer (electronics)Electrical engineeringGeologyPure mathematicsEngineeringGeophysicsMathematicsSilicon and Solar Cell TechnologiesThin-Film Transistor TechnologiesIntegrated Circuits and Semiconductor Failure Analysis