Litcius/Paper detail

Effect of interface structure on thermal conductivity and stability of diamond/aluminum composites

Ping Zhu, Qiang Zhang, Shuo Qu, Zhijun Wang, Huasong Gou, С. В. Шилько, Equo Kobayashi, Gaohui Wu

2022Composites Part A Applied Science and Manufacturing53 citationsDOI

Topics & Concepts

Materials scienceDiamondThermal conductivityComposite materialMicrostructureThermal shockComposite numberAluminiumThermal stabilityCoatingChemical engineeringEngineeringAdvanced ceramic materials synthesisDiamond and Carbon-based Materials ResearchThermal properties of materials