Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
Zhong-Jie Hong, Demin Liu, Hanwen Hu, Chih-I Cho, Ming-Wei Weng, Jui-Han Liu, Kuan‐Neng Chen
Topics & Concepts
PassivationAnodic bondingMaterials scienceThermocompression bondingDiffusion bondingAmorphous solidRecrystallization (geology)Grain boundaryCrystallinityDirect bondingTransmission electron microscopyMetallurgyLayer (electronics)CrystallographyComposite materialNanotechnologyChemistrySiliconMicrostructurePaleontologyBiology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies