17.4 Peak-Current-Controlled Ganged Integrated High-Frequency Buck Voltage Regulators in 22nm CMOS for Robust Cross-Tile Current Sharing
Nachiket Desai, Harish K. Krishnamurthy, Khondker Zakir Ahmed, Sheldon Weng, Suhwan Kim, Xiaosen Liu, Trương Thu Hương, Kaladhar Radhakrishnan, Krishnan Ravichandran, James Tschanz, Vivek De
Abstract
High-performance many-core processors and GPUs demand 100s of Watts of power in a single voltage/power domain on chip, operating below 1V. High-frequency and highcurrent-density fully integrated voltage regulators (FIVRs) with in-package air core inductors (ACIs) [1] or on-package magnetic inductors can deliver power with high efficiency and low distribution losses in compact footprints. Multiple FIVR tiles must be “ganged” to support the large on-chip voltage/power domains while meeting the reliability constraints of the active and passive elements, and maintaining high overall efficiency.