Particle Size Effects of Nano-Ag Films on the Interface Sintered Bonding for Die Attachment
Zhongyang Deng, Guisheng Zou, Rongbao Du, Qiang Jia, Hongqiang Zhang, Lei Liu
Topics & Concepts
Materials scienceComposite materialPulsed laser depositionSinteringNano-Shear strength (soil)Thin filmNanotechnologyEnvironmental scienceSoil scienceSoil waterElectronic Packaging and Soldering TechnologiesAdditive Manufacturing Materials and ProcessesLaser Material Processing Techniques